Picosecond Laser Cutting Machine (JG32)

USAGE

The machine is used in cutting for CVL/FPC/RF and thin multilayer board, as well as cutting a variety of substrates, such as ceramic, silicon, aluminium foil, teflon, etc..

CHARACTERISTICS

1. Completely cold cutting, almost no carbonizing.

2. High effiency, times speed higher than nano laser cutting.

3. Two tables to cycle working one by one, no preparing time, high processing effiency.

4. Preview function before processing to avoid damaging sample.

5. Barcode marking function

TECHNICAL PARAMETER

Applied Range                                   FPC, CVL, FPC Micro-jointing, Ceramic, Silicon, etc.                      

System Processing Accuracy                                             ±20μm

 (ZHENGYE Conditions)

Laser power                                                       15W@400kHz/30W@2MHz

Laser Wavelength                                                                355nm

Pulse width                                                                          10ps

Frequency range                                               400kHz-1MHz/1.2MHz-2MHz

Objects                                                   Large processing size: 550mm×650mm

                                                              Table number: Single beam, Dual platform

Dimensions(L×W×H)                         2200×2150×1750mm(Not include the tri-colored light)

Weight                                                                              3700Kg